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Science 15 December 2006:
Vol. 314. no. 5806, pp. 1754 - 1757
DOI: 10.1126/science.1132394
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Reports

Heterogeneous Three-Dimensional Electronics by Use of Printed Semiconductor Nanomaterials

Jong-Hyun Ahn,1,2,3 Hoon-Sik Kim,5 Keon Jae Lee,1,3 Seokwoo Jeon,1,2,3 Seong Jun Kang,1,2,3 Yugang Sun,1,2,3 Ralph G. Nuzzo,1,2,3,4 John A. Rogers1,2,3,4,5*

We developed a simple approach to combine broad classes of dissimilar materials into heterogeneously integrated electronic systems with two- or three-dimensional layouts. The process begins with the synthesis of different semiconductor nanomaterials, such as single-walled carbon nanotubes and single-crystal micro- and nanoscale wires and ribbons of gallium nitride, silicon, and gallium arsenide on separate substrates. Repeated application of an additive, transfer printing process that uses soft stamps with these substrates as donors, followed by device and interconnect formation, yields high-performance heterogeneously integrated electronics that incorporate any combination of semiconductor nanomaterials on rigid or flexible device substrates. This versatile methodology can produce a wide range of unusual electronic systems that would be impossible to achieve with other techniques.

1 Department of Materials Science and Engineering, University of Illinois, Urbana-Champaign, IL 61801, USA.
2 Beckman Institute for Advanced Science and Technology, University of Illinois, Urbana-Champaign, IL 61801, USA.
3 Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, IL 61801, USA.
4 Department of Chemistry, University of Illinois, Urbana-Champaign, IL 61801, USA.
5 Department of Electrical and Computer Engineering, University of Illinois, Urbana-Champaign, IL 61801, USA.

* To whom correspondence should be addressed. E-mail: jrogers{at}uiuc.edu

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Science. ISSN 0036-8075 (print), 1095-9203 (online)