Simultaneous Tomography and Diffraction Analysis of Creep Damage
A. Pyzalla,1*
B. Camin,2
T. Buslaps,3
M. Di Michiel,3
H. Kaminski,1
A. Kottar,1
A. Pernack,2
W. Reimers2
Creep damage by void nucleation and growth limits the lifetime
of components subjected to loading at high temperatures. We
report a combined tomography and diffraction experiment using
high-energy synchrotron radiation that permitted us to follow
in situ void growth and microstructure development in bulk samples.
The results reveal that void growth versus time follows an exponential
growth law. The formation of large void volumes coincides with
texture evolution and dislocation density, reaching a steady
state. Creep damage during a large proportion of sample creep
life is homogeneous before damage localization occurs, which
leads to rapid failure. The in situ determination of void evolution
in bulk samples should allow for the assessment of creep damage
in metallic materials and subsequently for lifetime predictions
about samples and components that are subject to high-temperature
loading.
1 Technische Universität (TU) Wien, Institute of Material Science and Technology, Karlsplatz 13-308, A-1040 Wien, Austria.
2 TU Berlin, Institute of Material Science and Technology, Sekr. BH18, Ernst-Reuter-Platz 1, D-10587 Berlin, Germany.
3 European Synchrotron Radiation Facility (ESRF), BP220, F38043 Grenoble, France.
* To whom correspondence should be addressed. E-mail: anke.pyzalla{at}tuwien.ac.ot