Micropatterning of Organic Electronic Devices by Cold-Welding
Changsoon Kim,
Paul E. Burrows,
Stephen R. Forrest
*
A simple and general postdeposition electrode patterning technique
for active organic electronic devices is demonstrated and is applied to
patterning the metal cathodes of organic light-emitting devices.
Selective lift-off of the metal cathode layer is achieved by pressing a
prepatterned, metal-coated silicon stamp on the unpatterned device
layers. Under pressure, the metal coating on the stamp cold-welds to
the metal cathode coating the underlying organic films.
Subsequent separation of the stamp from the substrate results in
removal of the cathode metal in the regions contacted by the stamp,
resulting in submicrometer feature definition. A 17×17 passive matrix
display, with a pixel size of 440 micrometers by 320 micrometers, was
fabricated with this process. Cold-welding followed by lift-off of the
cathode metal allows simple, cost-effective, and high-throughput
large-area fabrication of organic electronic devices.
Center for Photonics and Optoelectronic Materials (POEM),
Department of Electrical Engineering, and the Princeton Materials
Institute, Princeton University, Princeton, NJ 08544, USA.
*
To whom correspondence should be addressed. E-mail:
forrest{at}ee.princeton.edu
