Electrochemical Defect-Mediated Thin-Film Growth
K. Sieradzki,
*
S. R. ,
Brankovic,
N. Dimitrov
An electrodeposition technique is described that produces
atomically flat epitaxial metal overlayers of quality similar to that
obtained by ultrahigh vacuum techniques at elevated temperature. In
this approach, a metal of interest such as silver is co-deposited with
a reversibly deposited mediator metal. The mediator is periodically deposited and stripped from the surface, and this serves to
significantly increase the density of two-dimensional islands of silver
atoms, promoting a layer-by-layer thin-film growth mode. In situ
scanning tunneling microscopy was used to demonstrate the growth
process for the heteroepitaxial system silver/gold (111) with either
lead or copper as the mediator.
Department of Mechanical and Aerospace Engineering,
Arizona State University, Tempe, AZ 85287-6106, USA.
*
To whom correspondence should be addressed. E-mail:
karl@icarus.eas.asu.ed