Room Temperature-Operating Spin-Valve Transistors Formed by Vacuum Bonding
D. J. Monsma,
*
R. Vlutters,
J.
C. Lodder
Functional integration between semiconductors and ferromagnets was
demonstrated with the spin-valve transistor. A ferromagnetic multilayer
was sandwiched between two device-quality silicon substrates by means
of vacuum bonding. The emitter Schottky barrier injected hot electrons
into the spin-valve base. The collector Schottky barrier accepts only
ballistic electrons, which makes the collector current very sensitive
to magnetic fields. Room temperature operation was accomplished by
preparing Si-Pt-Co-Cu-Co-Si devices. The vacuum bonding technique
allows the realization of many ideas for vertical transport devices and
forms a permanent link that is useful in demanding adhesion
applications.
MESA Research Institute, University of Twente, 7500AE Enschede,
Netherlands.
*
To whom correspondence should be addressed. Present address: IBM
Almaden Research, 650 Harry Road, San Jose, CA 95120, USA.