Stretchable and Foldable Silicon Integrated Circuits

doi:10.1126/science.1154367

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Originally published in Science Express on 27 March 2008
Science 25 April 2008:
Vol. 320. no. 5875, pp. 507 - 511
DOI: 10.1126/science.1154367

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Stretchable and Foldable Silicon Integrated Circuits

Dae-Hyeong Kim,¹^* Jong-Hyun Ahn,²^* Won Mook Choi,¹^* Hoon-Sik Kim,¹ Tae-Ho Kim,¹ Jizhou Song,³ Yonggang Y. Huang,⁵ Zhuangjian Liu,⁶ Chun Lu,⁶ John A. Rogers¹^,3^,4

We have developed a simple approach to high-performance, stretchable,and foldable integrated circuits. The systems integrate inorganicelectronic materials, including aligned arrays of nanoribbonsof single crystalline silicon, with ultrathin plastic and elastomericsubstrates. The designs combine multilayer neutral mechanicalplane layouts and "wavy" structural configurations in siliconcomplementary logic gates, ring oscillators, and differentialamplifiers. We performed three-dimensional analytical and computationalmodeling of the mechanics and the electronic behaviors of theseintegrated circuits. Collectively, the results represent routesto devices, such as personal health monitors and other biomedicaldevices, that require extreme mechanical deformations duringinstallation/use and electronic properties approaching thoseof conventional systems built on brittle semiconductor wafers.

¹ Department of Materials Science and Engineering, Beckman Institute, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, IL 61801, USA.
² School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, 440-746, Korea.
³ Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, 1206 West Green Street, Urbana, IL 61801, USA.
⁴ Departments of Chemistry, Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, 1304 West Green Street, Urbana, IL 61801, USA.
⁵ Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
⁶ Institute of High Performance Computing, 1 Science Park Road, #01-01 The Capricorn, Singapore Science Park II, Singapore 117528.

^* These authors contributed equally to this work.

To whom correspondence should be addressed. E-mail: jrogers{at}uiuc.edu (J.A.R.); y-huang{at}northwestern.edu (Y.Y.H.)

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